{"id":8075,"date":"2026-06-24T11:00:14","date_gmt":"2026-06-24T03:00:14","guid":{"rendered":"https:\/\/www.akademisains.gov.my\/asm-focus\/?p=8075"},"modified":"2026-07-27T16:44:32","modified_gmt":"2026-07-27T08:44:32","slug":"malaysia-science-endowment-strengthens-national-innovation-ecosystem","status":"publish","type":"post","link":"https:\/\/www.akademisains.gov.my\/asm-focus\/malaysia-science-endowment-strengthens-national-innovation-ecosystem\/","title":{"rendered":"Malaysia Science Endowment Strengthens National Innovation Ecosystem"},"content":{"rendered":"

ASM has reaffirmed the importance of the Malaysia Science Endowment<\/a> (MSE) as a sustainable funding mechanism to strengthen the country\u2019s research, development, innovation, commercialisation, and economic (RDICE) ecosystem.<\/p>\n

MSE is a key initiative under the National Science, Technology and Innovation Policy (DSTIN) 2021\u20132030 and the Twelfth Malaysia Plan (RMKe-12<\/a>), providing long-term, stable support for science and technology advancement.<\/p>\n

Approved by Parliament in 2022, the MSE positions ASM as the implementing agency under MOSTI. The initiative is designed to complement traditional funding models by offering a more flexible and sustainable approach to financing high-impact R&D and innovation activities.<\/p>\n

The significance of this initiative was highlighted during a working visit to Penang on 8 May 2026 by Minister of Science, Technology and Innovation<\/a>, YB Datuk Chang Lih Kang. Accompanying him were Minister of Economy<\/a>, YB Akmal Nasrullah Mohd Nasir; Deputy Minister of Investment, Trade and Industry<\/a>, YB Sim Tze Tzin; and MOSTI Secretary-General, Datuk Ts Dr K. Nagulendran.<\/p>\n

The delegation reviewed the progress of the MSE Advanced Packaging R&D Project, a key effort to develop local advanced packaging capability in \u00a0Malaysia\u2019s semiconductor industry.<\/p>\n

They were joined by ASM President, Academician Datuk Dr Tengku Mohd Azzman Shariffadeen FASc<\/a>, and ASM CEO, Puan Hazami Habib FASc<\/a>, reflecting strong institutional leadership and cross-ministerial collaboration.<\/p>\n

The programme involves five companies from different segments of the semiconductor value chain, working together to deliver a Made-in-Malaysia proof-of-concept test chip for High Bandwidth Memory 4 (HBM4<\/a>). This has led to the formation of the Malaysia Advanced Packaging Consortium (MAPC<\/a>), which aims to position Malaysia as a global leader in semiconductor advanced packaging, targeting a 7% share of the global advanced packaging market by 2035.<\/p>\n

Overall, the MSE marks a forward-looking approach to strengthening Malaysia\u2019s innovation landscape. By combining sustainable funding with strategic industry collaboration, it plays a vital role in advancing the nation\u2019s technological capabilities and global competitiveness.<\/p>\n\n\t\t\t